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Technical Terms
A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

Abbreviations
A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

Technical Terms
A
Acceleration sensor, 33
Accumulator architecture, 38
Application, 62
Assembler, 46
Avalance breakdown > p-n junction

B
Back-up battery, 50
Base, 17
Bipolar transistor, 17
Breakdown voltage > p-n junction
Bridge rectifier, 14
Bus, 5, 24, 44

C
Capacitance, 12
Capacitor, 12
Charge-coupled device (CCD), 31
Chip (manufacture), 68ff
Circuit diagram (circuit example), 52
Circuit diagram, 65
Circuit example, 46ff
CISC architecture, 41
Clock-pulse generator, 24
CMOS transistor, 19
Collector, 17
Compiler, 46
Component layout (circuit example), 53
Component(s) list, 51, 65
Components, 12
Conductivity (electrical), 8
Conductor (electric) > conductivity
CPU, 36

D
Data adaptation, 62
Decode instruction phase, 40
Depletion layer > p-n junction
Design process (layout), 54
Destructive instruction set architecture, 39
Development circuit > circuit example
Development specifications, 60
Dielectric constant, 12
Dielectric, 12
Digital circuits, 22
Diode, 14
DMA, 43
Doping process, 68f
Doping, 9f
Drain, 18

E
ECU development, 60
EEPROM, 29
Electrolytic capacitor, 12
Electromagnetic compatibility (EMC), 6
Electromagnetic testing, 67
Electronics, 8, 87
Embedded systems, 34
EMC testing, 67
Emitter, 17
Epitaxy, 69
EPROM, 29
Evaluation board > circuit example
Execute phase, 40

F
Farad, 12
Fetch instruction phase, 40
Fetch operand phase, 40
Field-effect transistor, 18
Film circuits (manufacture), 78
Fixed-length instruction set, 39
Flash EEPROM, 29
FMEA, 63
Function description, 62
Function development, 62

G
Gate/Gates, 18, 23
Gordon Moore"s Law, 21

H
Half-wave rectifier, 14
Hall-effect sensor, 32
Hardware design prototypes, 64
Hardware development, 62, 64ff
Hardware, 62
Harvard architecture, 45
Henry, 13
Hole p-type > doping
Hybrid circuits (manufacture), 78f

I
Inductance, 13
Instruction set, 40
Instruction-set architecture, 39
Insulator > conductivity
Interrupt, 38
Intrinsic conductivity (semiconductor), 10
Inverter, 24
Isolated peripherals, 42

L
Laser diode, 31
Lattice defect p-type > doping
Layout (circuit example), 59
Layout, 54, 65
LED, 30
Light-emitting diode, 30
Linker, 46

M
Magnetoresistor, 16
Memory, 27, 41
Memory-mapped peripherals, 42
Memory-memory architecture, 38
Memory-register architecture, 38
Metal-film resistor, 12
Microcomputer system, 36
Microcontroller, 34, 36
Microelectronics, 8
Micromechanical sensors, 32
Micromechanics, 72
Microprocessor, 24
Mnemonics, 46
Monitoring program, 47
Multilayer (circuit board), 73
Multilayer capacitor, 12
Multilayer substrate (manufacture), 78
Multiple instruction length, 40
Multiple instruction set, 39

N
Networking, 4
NMOS transistor, 19
Non-conductor > conductivity
Non-destructive instruction-set architecture, 39
NTC thermistor, 16
n-type doping > doping

O
Object code, 47
Ohm, 12

P
Panel (printed circuit board), 75
Panel plating
  > printed-circuit board (manufacture)
Pattern plating
  > printed-circuit board (manufacture)
Peripheral modules, 42
Peripherals, 36
Photodiode, 30
Photolithography, 70
Photoresistor, 30
Phototransistor, 31
Photovoltaic cell, 30
Pipeline, 41
Planar process, 70
PMOS transistor, 19
p-n junction, 10f
Polled I/O, 43
Pressure sensor, 33
Printed-circuit board (manufacture), 73ff
Printed-circuit board (types), 73
Printed-circuit board, 66
Product specifications, 60
Programming I/O, 43
Programming (circuit example), 58
Programming model, 37
PROM, 29
Prototype construction, 66
PTC thermistor, 16
p-type doping > doping

Q
Quality assessment, 63
Quality management, 63

R
RAM, 27
Random-access memory, 27
Rectification, 15
Rectifier diode, 15
Register, 37
Register-register architecture, 39
Resistor, 12
Reverse current > p-n junction
Review, 63
RISC architecture, 41
ROM, 29

S
Schottky diode, 15
Semiconductor components (manufacture), 68ff
Semiconductor components, 13
Semiconductor, 8ff
Single-chip computer, 26, 34
Software development, 62
Software, 62
Source code, 46f
Source, 18
Space-charge zone > p-n junction
Store operand phase, 41
Subroutine, 59
Subactive process
  > printed-circuit board (manufacture)
Surface-mounting method, 75

T
Temperature coefficient, 14
Tenting process
  > printed-circuit board (manufacture)
Thermographics, 66
Thick-film circuits (manufacture), 78
Thin-film circuits (manufacture), 78
Through-fitting method (printed circuit board>, 75
Thyrisor, 19
Transistor, 17ff
Transputer, 26
Tunnel diode, 15

U
Unipolar transistor, 18
Units, 86
User program, 47

V
Varistor, 16
Via (multilayer substrate), 78f
Von-Neumann architecture, 45

W
Wafer (semiconductor manufacture), 68ff
Wiring harness, 4
Wound capacitor, 12
Write-back phase, 41

Z
Zener breakdown > p-n junction
Zener diode, 15

Abbreviations
A
ABS: Antilock braking system
ADC: Analog-digital converter
ALE: Address Latch Enable
ALU: Arithmetic logic unit
ASIC: Application-specific integrated circuit
ASR: "Antriebsschlupfregelung",
  i.e. traction control
ASSP: Application-specific standard product

B
BKS: "Bauteilkontrollsystem",
  i.e. component checking system
  ( > printed-circuit-board manufacture, production process)

C
CAD: Computer-aided design
CAE: Computer-aided engineering
CAM: Computer-aided manufacturing
CCD: Charged-coupled device
CISC: Complex instruction-set computer
CPU: Central processing unit
  (of a > microcontroller)

D
DAC: Digital-analog converter
DMA: Direct-memory access

E
EEPROM: Electrically erasable programmable read-only memory
EMC: Electromagnetic compatibility
EPROM: Erasable programmable read-only memory
ESP: Electronic stability program

F
FET: Field-effect transistor
Flash-EPROM: Flash erasable programmable read-only memory

H
HDL: Hardware Description Language

I
I/O ports: Input/output ports
IC: Integrated circuit
ICT: In-circuit test
  ( > printed-circuit-board manufacture, production process)

L
LED: Light-emitting diode
LKS: "Lagekontrollsystem",
  i.e. position checking system
  ( > printed-circuit-board manufacture, production process)
LSI: Large-scale integration
LTCC: Low-temperature cofired ceramic

M
MOS: Metal-oxide semiconductor
MSI: Medium-scale integration

P
PC: Personal computer
PROM: Programmable read-only memory

R
RAM: Random-access memory
RISC: Reduced instruction-set computer
ROM: Read-only memory

S
SiO2: Silicon dioxide
SMD: Surface-mounted device
SMT: Surface-mounting technology
SoC: System on a chip
SSI: Small-scale integration

T
TCS: Traction control system

U
UV light: Ultraviolet light

V
VHDL: Visual Hardware Description Language
VLSI: Very-large-scale integration

μC: Microcontroller